Megasonic Spray System​

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Shower Type Megasonic Nozzle
Features
  • Single point spray megasonic cleaning, compared with traditional tank cleaning, can solve the problem of secondary pollution of cleaning solution.
  • Extremely low ultrasonic cavitation effect, no damage to device surface, suitable for megasonic wafer cleaning
  • Ultra-high megasonic cleaning precision, which can remove dirt particles in 0.2 micron on the object surface
  • Made of non-metallic high anti-corrosion materials, suitable for various acid-base and organic solvents
  • Quartz or sapphire coupling layer technology, no risk of impurities falling off the device
  • Unique transducer bonding technology gives higher stability and durability
  • Megasonic cleaning generator using the third-generation semiconductor technology, fully realizing digital high-frequency and high-power drive
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Megasonic cleaning employs ultrasonic energy at a significantly higher frequency within the megahertz range, effectively enhancing the removal of submicron particles from substrates and facilitating chemical reactions. In contrast to low-frequency ultrasonic cavitations, megasonic cavitation yields more refined particle removal while minimizing damage to the substrates.

The shower-type megasonic cleaning system seamlessly incorporates the megasonic transducer into the nozzle apparatus. This innovative configuration enables the delivery of fluid imbued with megasonic energy directly onto the surface of substrates, such as wafers, thereby facilitating the cleaning process. One notable advantage of the shower-type megasonic cleaning system is its ability to perform precise, point-to-point cleaning on the substrate surface.

By positioning the megasonic focal point directly onto the wafer surface and orchestrating the movement of the wafer and megasonic cleaning nozzle, comprehensive surface cleaning is achieved. Furthermore, when compared to batch-type megasonic cleaning systems, the shower-type variant boasts higher efficiency in transferring megasonic power.

This eliminates the challenges associated with variations in the sound field caused by fluctuations in liquid depth within the tank, which are common in batch-type systems.

Additionally, the shower-type megasonic cleaning method eliminates the issue of secondary contamination resulting from particles dislodged from substrates and suspended in the cleaning fluid within the tank.
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Batch Type Megasonic Plate
Features
  • The megasonic vibrating plate can be directly installed at the bottom of the cleaning tank for secondary development
  • Megasonic emission sound field is evenly distributed to improve cleaning uniformity
  • Extremely low ultrasonic cavitation effect, no damage to device surface
  • High power megasonic transducer, the surface sound intensity of vibrating plate can reach more than 5w/cm2
  • Quartz or sapphire coupling technology, no risk of impurities falling off the device
  • It can be made of non-metallic high corrosion resistant materials, and is suitable for various acid-base and organic solvents
  • Unique transducer bonding technique provides higher stability and durability.
  • Megasonic generator using the third-generation semiconductor technology, fully realizing digital high-frequency and high-power drive
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Megasonic cleaning uses higher frequency ultrasonic energy in mega hertz scale to boost removal of submicron particles from substrates and chemical reactions. Compared to low frequency ultrasonic cavitations, megasonic cavitations effect can give smaller particles removal as well as less damage on the substrates.

The batch type megasonic plate can be easily assembled into process tank to build a batch type megasonic cleaning system for wafers. By using special coupling technique, piezoelectric transducer precisely matches with quartz or sapphire vibration layer to efficiently emit uniform sound field into the process tank.
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Cover Type Megasonic Unit
Features
  • Directly cover on the surface of the object to be cleaned with a small gap, providing higher energy conversion efficiency
  • Greatly reduce the use of cleaning fluid
  • Extremely low ultrasonic cavitation effect, no damage to device surface
  • No secondary pollution of cleaning fluid
  • Ultra-high cleaning precision, which can remove 0.2 micron particles on the object surface
  • Made of non-metallic high anti-corrosion materials, suitable for various acid-base and organic solvents
  • Quartz or sapphire matching layer technology, no risk of impurities falling off the device
  • Unique transducer bonding technology provides higher stability and durability
  • Megasonic generator using the third-generation semiconductor technology, fully realizing digital high-frequency and high-power drive
Megasonic cleaning utilizes high-frequency ultrasonic energy in the megahertz range to enhance the removal of submicron particles from substrates while minimizing substrate damage compared to low-frequency ultrasonic cavitation.

In batch-type megasonic cleaning, a large megasonic transducer generates a broad sound field, offering high cleaning efficiency. However, this approach may result in non-uniform sound field distribution within the tank, leading to reduced intensity at greater distances from the transducer and lower sound power transfer efficiency.

Conversely, shower-type megasonic cleaning directly focuses megasonic energy onto the substrate surface, achieving uniform sound field distribution by moving the substrate and megasonic nozzle. However, it demands a high flow rate of cleaning fluid, leading to wastage.

Cover-type megasonic cleaning represents an optimized solution, combining the advantages of both batch and shower types while mitigating their drawbacks. It efficiently transfers a broad area of megasonic energy to the substrate surface, ensuring high sound field uniformity and efficiency. Additionally, it optimizes the utilization of cleaning fluid.

Related Instrument

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Ultrasonic Spray System
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Ultrasonic Spray Nozzle
*Pictures shown above are for reference only.  Actual product may differ slightly.  
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